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Semi Auto Wafer Grinding M/C



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High speed & accuracy grinding for wafer back surface.  
1. Wafer size : 2" to 6" 
2. Grinding materials : silicon wafer, glass, sapphire, quartz, 
3. Grinding Method : in-feed grinding 
4. Operating system : Industrial touch PC + Motion PC(PMAC)

-SPECIFICATION 
1. θ-axis (chuck table rotation movement) 
1) Chuck table type : Porous chuck table to jig 
2) Chuck method : Vacuum 
3) Revolutions : 0~300 RPM 

2. Z-axis (spindle vertical movement) 
1) Vertical stroke : 150 mm 
2) Grinding feed speed : 0.0001~0.05 mm/s 
3) Vertical movement : 0.0001 mm/s 

3. Spindle 
1) Bearing : Ball bearing 
2) Motor : high frequency servo motor 
3) Out put : 1.5kw 
4) Revolution speed : 500~3,000 

4. Grinding wheel : 150mm(6”) 

5. Grinding accuracy 
1) Thickness variation within : 2.0um 
6. Machine size : 500(W)x750(D)x1600(H) 
7. Machine weight : 600kg 

-UTILITY SPECIFICATION 
1) Power supply : AC 220V, 60Hz, 3phase 
Power consumption : 2.5KVA 
Max power : 12kVA 
2) Air pressure : 5~6kgf/cm2 
3) Air flow rate : 150 L/min 
4) Water flow rate 
Grinding + cleaning : 5L/min 
Cooling : 2L/min