High speed & accuracy grinding for wafer back surface.
1. Wafer size : 2" to 6"
2. Grinding materials : silicon wafer, glass, sapphire, quartz,
3. Grinding Method : in-feed grinding
4. Operating system : Industrial touch PC + Motion PC(PMAC)
-SPECIFICATION
1. θ-axis (chuck table rotation movement)
1) Chuck table type : Porous chuck table to jig
2) Chuck method : Vacuum
3) Revolutions : 0~300 RPM
2. Z-axis (spindle vertical movement)
1) Vertical stroke : 150 mm
2) Grinding feed speed : 0.0001~0.05 mm/s
3) Vertical movement : 0.0001 mm/s
3. Spindle
1) Bearing : Ball bearing
2) Motor : high frequency servo motor
3) Out put : 1.5kw
4) Revolution speed : 500~3,000
4. Grinding wheel : 150mm(6”)
5. Grinding accuracy
1) Thickness variation within : 2.0um
6. Machine size : 500(W)x750(D)x1600(H)
7. Machine weight : 600kg
-UTILITY SPECIFICATION
1) Power supply : AC 220V, 60Hz, 3phase
Power consumption : 2.5KVA
Max power : 12kVA
2) Air pressure : 5~6kgf/cm2
3) Air flow rate : 150 L/min
4) Water flow rate
Grinding + cleaning : 5L/min
Cooling : 2L/min
조회 : 644
