Wafer cleaning equipment with high pressure water after dicing wafer.
-SPECIFICATION
1. Wafer size 6”/8”
2. Rotation speed(rpm) 3,000
3. Pump pressure(kgf/㎠) 10~140
-UTILITY SPECIFICATION
1. Power Supply :AC220V,3p/50/60Hz
2. Max.Power(KVA):1.5
3. Air Pressure (kgf/cm2):5
4. Air Flow Rate(NL/min):200
5. N2 Pressure (kgf/cm2):5
6. N2 flow Rate(NL/min):3
7. Machine Size:620x690x1200mm
8. Machine weight:90kg |
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