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Tape Mounter





그림1.jpg

Wafer adhesion equipment between dicing frame and 
film with wafer before dicing.

-SPECIFICATION 
1. Wafer size  2”~6” , 2”~8” 
2. UV protection film over 99%
3. Temp. control 30~60℃
4. Wafer holding  vacuum
5. Wafer holding base  Teflon
6. Rotation blade cutter function
7. Straight cutter
8. Film roll  2-way

-UTILITY SPECIFICATION 
1. Power supply : AC 220V, 60Hz, 3phase 
2. Air pressure (kgf/㎠) 5~7
3. Air flow rate(NL/min) 20
4. Machine weight 25,kg, 32(2~8”) kg
4. Machine size (WxDxH) 350x730x350/420x810x370(2~8”)