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Spin Dryer


 
작성일 : 15-12-01 11:05
Lapping & Polishing, Wafer Mounter
 글쓴이 : 최고관리자
조회 : 78  


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Wafer cleaning equipment with high pressure water after dicing wafer.
-SPECIFICATION 
1. Wafer size  6”/8” 
2. Rotation speed(rpm)  3,000
3. Pump pressure(kgf/㎠) 10~140

-UTILITY SPECIFICATION 
1. Power Supply :AC220V,3p/50/60Hz
2. Max.Power(KVA):1.5
3. Air Pressure (kgf/cm2):5
4. Air Flow Rate(NL/min):200
5. N2 Pressure (kgf/cm2):5
6. N2 flow Rate(NL/min):3
7. Machine Size:620x690x1200mm
8. Machine weight:90kg